The electronics of the future can be made even smaller and more efficient by getting more memory cells to fit in less space.

Y angtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as ...

Yangtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as well as 232 active layers, and analysts from TechInsights have managed to ...

Solidigm, a leading provider of innovative NAND flash memory solutions, today announced a multi-year extension of its agreement with Broadcom Inc. on the use of high-capacity solid-state drive (SSD) ...

Lam Research Corporation (NASDAQ:LRCX), a leading supplier of wafer fabrication equipment and services to the semiconductor industry, finds itself at a critical juncture as it navigates a complex ...

Despite the challenging pricing environment for NAND, Moore highlights that the company ... hard drive content solutions, and flash content solutions. The company was founded by Alvin B.

GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced ...

Learn More A new neural-network architecture developed by researchers at Google might solve one of the great challenges for large language models (LLMs): extending their memory at inference time ...

Leading NAND flash manufacturers have gradually cut output to stabilize market prices and prevent further declines, as they intend to uphold pricing even beyond the Lunar New Year break ...

However, because of its 3D vertical stacking technique and array designs, 3D NAND flash memory has more complicated data loss mechanisms compared to 2D NAND flash memory. As bit densities rise to Quad ...

Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong 999077, China Joint Research Centre of Microelectronics, The Hong Kong Polytechnic University, Kowloon, Hong ...

Moreover, ADATA has partnered with SMI to launch a series of embedded memory products including EMMC, EPOP, and UFS3.1. These products are equipped with MLC and 3D TLC NAND Flash, support a ...